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US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 3 for "Semiconductor device having low dielectric capacitance, and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,758, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device having low d... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor device having a reinforcing insulating layer corresponding to a via" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,759, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a reinforcing insu... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Semiconductor devices with electrical fuses and methods of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,760, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices with electrical... और पढ़ें


US Patent Issued to STMICROELECTRONICS on Nov. 3 for "SiC-based electronic device with fuse element for short-circuits protection, and manufacturing method thereof" (Italian Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,761, issued on Nov. 3, was assigned to STMICROELECTRONICS S.r.l. (Agrate Brianza, Italy). "SiC-based electronic device with fuse element for... और पढ़ें


US Patent Issued to Intel on Nov. 3 for "Package architectures with heterogeneous integration of various device thicknesses" (Arizona Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,762, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Package architectures with heterogeneous integration of various d... और पढ़ें


US Patent Issued to DENSO on Nov. 3 for "Semiconductor module and power module including the same" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,763, issued on Nov. 3, was assigned to DENSO Corp. (Kariya, Japan). "Semiconductor module and power module including the same" was invented ... और पढ़ें


US Patent Issued to SILICONWARE PRECISION INDUSTRIES on Nov. 3 for "Electronic package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,764, issued on Nov. 3, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and manufactur... और पढ़ें


US Patent Issued to NANYA TECHNOLOGY on Nov. 3 for "Package structure including heat sink structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,765, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Package structure including heat sink structure an... और पढ़ें


US Patent Issued to AMD DESIGN on Nov. 3 for "Heat sink with heat pipe handle portion" (New Jersey, Washington Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,766, issued on Nov. 3, was assigned to AMD DESIGN LLC (Wilmington, Del.). "Heat sink with heat pipe handle portion" was invented by Sruti Ch... और पढ़ें


US Patent Issued to DENSO International America, DENSO on Nov. 3 for "Emitters for integrated power card cooling" (Canadian, American Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,767, issued on Nov. 3, was assigned to DENSO International America Inc. (Southfield, Mich.) and DENSO Corp. (Kariya-city, Japan). "Emitters ... और पढ़ें